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ATX Kunshan TOP > Services > Characterization Services |
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 Thermal Thermal Characterization As operating frequency increases and transistors decrease in size, the power densities of devices are becoming higher and higher. The need for small form factor and functional integration (MCM/SiP) present some challenges to thermal management. ATXKS provides simulation and measurement services that help our customers to overcome these thermal issues. These services include: Throughout pre-design phases:  Package thermal resistance simulation Heat sink effect evaluations Preliminary thermal studies for advanced packagesThroughout design phases: Hot spots impact evaluations Customized heat sink effectsThroughout post-design phases: Thermal measurementsThermal measurements include the measurements for package thermal parameters: JA (Junction-to-ambient thermal resistance) JC (Junction-to-case thermal resistance) JB (Junction-to-board thermal resistance) JT (Junction-to-top thermal characterization parameter) JB (Junction-to-board thermal characterization parameter)Electrical Electrical Characterization The electrical team at ATXKS is dedicated to providing IC package electrical characteristic design and analysis in terms of simulation and measurement. We also work closely with customers to provide customized IC packaging solutions. Our characterization services include: R.L.C for critical Traces R.L.C for Min/Max Traces IBIS Model SPICE Model Power Noise Analysis Ground Noise Analysis Impedance Analysis Cross Talk Noise Analysis Noise Isolation Analysis Signal Integrity Analysis S-parameters Analysis Customized Design ServiceStress & Reliability Reliability Characterization Reliability characterization is used to analyze package reliability through measurement. Analysis also consists of root cause investigation into packaging failure (like die crack, delamination) and optimal design for low stress and high reliability. Our characterization service includes: Board Level Reliability Test and Simulation Temperature cyclic test Drop test (under set up) Failure analysis Failure Analysis Encapsulant: Incomplete fill / Wire sweep / Warpage /
Delamination / Void Silver epoxy: Outgassing / Delamination / Void / Bleed Substrates: Warpage / Contamination / Crack Flux: Flux residue / Outgassing / Corrosion Lead frame: Contamination / Moisture uptake Under fill: Delamination / Void
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