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ATXKS product portfolio encompasses wafer probe, substrate and leadframe design, electrical/thermal/stress simulation, packaging and final test. With expertise in product and advanced process technologies, we are currently in volume production of packages including CSP, MCM/stacked-die, and thermally enhanced varieties. We also provide more traditional packages such as SOP, PDIP, QFP,LGA and BGA. Close collaboration amongst affiliated companies within ATX Group has enabled us to vertically link up activities across the manufacturing value chain. Our one-stop solution gives customers clear benefits, including improved time-to-market and total cost management.
Covering all existing and developing IC packages available at ATX, this product information provides detailed descriptions of the performance, package outline, characterization data, standard processes, and materials of each product.
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