ATX Business Offerings

ATXSZ with rich heritage of engineering superiority and manufacturing excellence from both ASE and NXP. With over 20 years of IC assembly and testing experience in China, serving both domestic and international markets.

ATXSZ provides a highly integrated semiconductor OSAT services including IC package & substrate design, engineering sample production, failure analysis & reliability test, wafer testing, IC assembly & package testing, and global distribution. In addition, fulfilling rapidly changing complexity of electronics market, ATXSZ offers SMT assembly among its portfolio of services to the customers.

Assembly

ATXSZ offers a wide spectrum of IC packages engineering and assembly services for Quad Flat Nonlead (QFN), Small Outline Plastic packages (SOP), Thin Small Outline Plastic packages (TSOP) and ball grid array (BGA). For automotive grade packages, we offers wettable flank QFN with our own patented dimpled leadframe technology.

Our flip-chip technology is applicable to BGA, LGA and QFN packages. The flip-chip QFN service comes in both molded-only and FC-SMT types, with services extended for CUF-molded and FC-wirebond types. Our technology advanced further which offered customers solution to FC-CSP. The coverage of our mass reflow process ranged from 180um bump pitch to 90um, with TCNCP process in place we will offer 70um to 50um bump pitch service.

We offers SMT technology serving customers with needs of RF modules and MEMS assembly, the process is coupled with wire bond and flip-chip and shielding technology. High volume production since 2013, delivering Tx, PA with duplexer and MMMB modules.

Testing

ATXSZ offers a broad range of wafer testing and final testing, matching assembly profile which customer benefit from seamless turnkey service.

Our wafer test platform established across TSK, TEL and EG, providing flexible capacity which enable 8" and 12" wafers probing.

Final test platform are also well established at ATXSZ for both digital and analog application, including testers from LTX-Credence, Teradyne, Advantest, AMIDA, MCT, SPEA, Macrotest and Aeroflex.

In addition, a wide selection of handler systems coupling with above test platform ensuring complete coverage of finished goods before delivering.

Our handler systems together with packaging function delivers tape & reel, tube and tray handling capability, the selection including RASCO, EPSON, MCT, ICOS, MicroVision, Hypersonic, VisDynamics, Hontech and Zhongyi.

Material

ATXSZ with more than a decade of engineering and production experience on leadframe and substrate packages, in particular with thin laminate.

Pre-plated leadframe (PPF), post-plated leadframe and core-less substrate are among the laminate technology applied in our service.

Our design capability extends options available to our customers against ever challenging market demand for micro profiles.

Reliability & FA

ATXSZ is equipped with a reliability and failure analysis laboratory, which benchmarked against EU & US standard offering QA service for consumer and automotive packages.

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