SOP/SSOP/TSSOP/TSOP/MFP




Product Overview
 
The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the smaller version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The reduced body size means flexible layout is required within a finite PCB area. Another advantage is that shorter leads improve the electrical performance.



Application
 
ATX’s SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances.



Features
 
SOP Body sizes 150 up to 300 mils
SSOP Body sizes 150 mils
SOP lead counts available from 7 to 28
SSOP lead counts available 20 & 24
TSOP lead counts available 48 & 56
JEDEC standard outlines
Existing BOM and process flow
Pb-free process ready and available



Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A103 Level 3, 30ºC/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65ºC to 150ºC, 100/300/500/1000 cycles
HAST JEDEC 22-A118 130ºC/85% RH, 33.5 PSI 48/96 hrs
HTST JEDEC 22-A103-B 150ºC, 500/1000 hrs
THT JEDEC 22-A101-B 85’C/85%RH 500/1000 hrs
PCT JEDEC 22-A102 121ºC/100%RH/15 psi ,96/168 hours
Thermal shock test JEDEC JESD22-A106 -65ºC~150ºC, 100 / 300 / 500 cycles
 
Board Level (Contact ATX for further details.)



Package Offering
 
Package Body Size Lead Count Pitch
SOP 150mil 7, 8, 14, 16 1.27mm
SOP EP 150mil 8, 14, 16 1.27mm
SOP 300mil 18, 20, 28 1.27mm
MFP 208mil 8 1.27mm
SSOP 150mil 24 0.635mm
SSOP 209mil 20 0.65mm
TSSOP 118mil 8, 10 0.65/0.5mm
TSSOP EP 118mil 8, 10 0.65/0.5mm
TSSOP 173mil 8, 14, 16, 20 0.65mm
TSSOP(1) 12x20mm 48 0.5mm
TSSOP(1) 14x20mm 56 0.5mm



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