Product Overview |
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The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the smaller version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The reduced body size means flexible layout is required within a finite PCB area. Another advantage is that shorter leads improve the electrical performance. |
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Application |
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ATX’s SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances. |
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Features |
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SOP Body sizes 150 up to 300 mils |
SSOP Body sizes 150 mils |
SOP lead counts available from 7 to 28 |
SSOP lead counts available 20 & 24 |
TSOP lead counts available 48 & 56 |
JEDEC standard outlines |
Existing BOM and process flow |
Pb-free process ready and available |
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Reliability |
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Package Level |
Test Item |
Reference Standard |
Condition/Duration |
MSL |
JEDEC 22-A103 |
Level 3, 30ºC/60% RH, 192 hrs |
TCT |
JEDEC 22-A104-B |
-65ºC to 150ºC, 100/300/500/1000 cycles |
HAST |
JEDEC 22-A118 |
130ºC/85% RH, 33.5 PSI 48/96 hrs |
HTST |
JEDEC 22-A103-B |
150ºC, 500/1000 hrs |
THT |
JEDEC 22-A101-B |
85’C/85%RH 500/1000 hrs |
PCT |
JEDEC 22-A102 |
121ºC/100%RH/15 psi ,96/168 hours |
Thermal shock test |
JEDEC JESD22-A106 |
-65ºC~150ºC, 100 / 300 / 500 cycles |
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Board Level (Contact ATX for further details.) |
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Package Offering |
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Package |
Body Size |
Lead Count |
Pitch |
SOP |
150mil |
7, 8, 14, 16 |
1.27mm |
SOP EP |
150mil |
8, 14, 16 |
1.27mm |
SOP |
300mil |
18, 20, 28 |
1.27mm |
MFP |
208mil |
8 |
1.27mm |
SSOP |
150mil |
24 |
0.635mm |
SSOP |
209mil |
20 |
0.65mm |
TSSOP |
118mil |
8, 10 |
0.65/0.5mm |
TSSOP EP |
118mil |
8, 10 |
0.65/0.5mm |
TSSOP |
173mil |
8, 14, 16, 20 |
0.65mm |
TSSOP(1) |
12x20mm |
48 |
0.5mm |
TSSOP(1) |
14x20mm |
56 |
0.5mm |
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