| Overview |
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| Dual-in-Line packages have been an industry standard for many years. The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using PTH (plated through hole) and SMT (surface mount technology) assembly, dual-in-line packages provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs. |
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