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ATXSH providing a total solution include wafer probe, substrate and leadframe design, electrical/thermal/stress simulation, packaging and final test. We possess the required expertise in product and advanced process technology for the manufacture of CSP, MCM/stacked-die, thermally enhanced packages. We also provide traditional package like SOP, PDIP, QFP and BGA. The collaboration among affiliated companies within the ATX Group has enabled us to vertically link up activities across the manufacturing value chain. Our one-stop solution gives our customers clear benefits of improved time-to-market and total cost management.
Covering all existing and developing IC packages available at ATX, this product information provides detailed descriptions of the performance, package outline, characterization data, standard processes, and materials of each product.
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