| Product Overview |
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| Quad flat package (QFP) is popular among the quad package types. Fine etching or stamping on lead frames enable QFP to contain more leads and feature a smaller profile to perform better electrical characteristics by shortening the interconnection (the lead width can be as small as 0.16mm while the outer lead pitch is 0.4mm only). The thinner and flexible leads in the gull-wing shape also provide better second-level reliability (package-to-PCB reliability). |
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| Application |
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Products
 Portable consumer products (PDA, Digital camera, and many more)
System boards
Power controllers
Quad packages have been used for years to meet increasing challenges presented by faster processors / controllers, ASICs, DSPs, gate arrays, logic, memory ICs (EEPROM, Flash, DRAM & SRAM), PC chipset, video-DAC, multi-media and other related application.
HS-QFP is suitable for use in high thermal applications including power & voltage regulators, power amplifiers, and more. |
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| Features |
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| High-speed data processing |
| High density interconnection |
| Cost Competitive |
| MCM /Stack structure design |
| High thermal conductive |
| Fine Pitch wireobond capability |
| Pb-free process ready and available |
| JEDEC standard compliant |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 500/1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 PSI 48/96 hrs |
| HTST |
JEDEC 22-A103-B |
150°C, 500/1000 hrs |
| THT |
JEDEC 22-A101-B |
85°C/85%RH 500/1000 hrs |
| PCT |
JEDEC 22-A102 |
121°C/100%RH/15 psi ,96/168/300 hours |
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| Package Offering |
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| Package |
Body Size |
Lead Count |
Pitch |
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