| Product Overview |
| |
| This thin package solution has become available due to significant improvement in substrate and die thinning technology. |
| Package |
Total Thickness |
Package Profile |
Solder Ball Pitch |
| LFBGA |
1.20~1.70mm |
Low Profile |
Fine Solder Ball Pitch |
| TFBGA |
1.00~1.20mm |
Thin Profile |
Fine Solder Ball Pitch |
| VFBGA |
0.80~1.00mm |
Very Thin Profile |
Fine Solder Ball Pitch |
|
| * Small, thin and light package |
| * Flexible design |
| * Low cost and & time to market high volume production |
| * Competitive reliability performance (MSL3@260°C) |
|
| Application |
| |
| FBGA is traditionally used in hand-held devices, and is now increasingly targeting the computer, communication, and consumer device market. Growing demand for thin packages with high density performance make FBGA a highly competitive and reliable package solution. This package is highly recommended for Memory (SRAM, PSRAM, Flash, DRAM), graphics, ASIC, digital and analog products. |
|
| Features |
| |
 |
| |
| 3x3 mm to 21x21 mm body size available |
| Max 672 I/Os |
| 0.4/0.5/0.65/0.75/0.8/1.0 mm in ball pitch |
| Rigid and customized routing substrate design |
| High density interconnection |
| Full in-house design capability |
| Fine pitch wire bond capability |
| Low assembly cost |
| Self-alignment during re-flow |
| High speed performance |
| Lower profile (Package thickness) |
| RoHS/ Pb Free & Green Package process ready and available |
| EATX of thermal and electrical management |
| EATX of routing |
| JEDEC standard criteria |
|
|
| Reliability |
| |
| MSL3@260°C |
| Test Item |
Reference |
Condition/Duration |
| MSL Level 3 |
JEDEC 22-A103 |
30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 500, 1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 PSI, 50/100, hrs |
| HTST |
JEDEC 22-A103-B |
150°C 500/1000 hrs |
| THT |
JEDEC 22-A101-B |
85°C/85%RH 500/1000 hrs |
|
|
| Package Structure |
| |
 |
| ItemThickness (Total) |
Units |
LFBGA |
| Total Thickness (Max) |
mm |
1.20~1.70 |
| Mold ThicknessPackage size (A) |
mm |
0.53~0.91 |
| Substrate thickness (B) |
mm |
0.21~0.56 |
| Solder ball height (C) |
mm |
0.16~0.46 |
| Wafer thickness (D) |
um |
125~200 |
| Max Epoxy (E) |
um |
50 |
| Max Loop height (F) |
um |
200 |
| ItemThickness (Total) |
Units |
VFBGA |
| Total Thickness (Max) |
mm |
1.00 |
| Mold ThicknessPackage size (A) |
mm |
0.45 |
|
|
| Package Offering |
| |
| Package |
Body Size |
Lead Count |
| FBGA |
7x9mm |
56 |
| FBGA |
9x9mm |
200 |
FBGA |
11.5x11mm |
277 |
| FBGA |
11x13mm |
64 |
|
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