Quad  T/LQFP



Product Overview
 
Low profile and thin quad flat packages (QFP) are classified by the overall thickness (t) according to JEDEC definition:
L type: 1.2< t <=1.7 mm
T type: 1< t <=1.2 mm
Low profile and thin QFPs are becoming popular, as they are ideal for the applications in lightweight and portable electronic products. ATX offers the lead count of LQFP/TQFP ranging from 32 to 256 and 44 to 176 respectively, covering almost all the applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.
 
Exposed Pad L(T)QFP
The exposed pad can be soldered to the PCB so that the heat can be driven off directly (the JA is only half as much as the standard L(T)QFP). Besides, this pad is also electrically grounded, and thus results in far smaller ground inductance. Exposed pad L(T)QFP is a cost-effective solution suitable for enhancing thermal and electrical performance.



Application
 
Telecommunication products
Cellular phones
Wireless LAN

Portable products
Personal computer
Personal digital assistants
Digital camera

Medium lead count packages
Information appliances

LQFP / TQFP
LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.

EP-TQFP
Exposed Pad TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common application of Exposed Pad TQFP packages are telecommunication, wireless, pagers, disk drives and RF modules.



Features
 
LQFP/EP-LQFP Packing Offering
7 x 7 mm to 28 x 28 mm body size available
Wide selection of pad size to meet die requirements
Customize leadframe design capability
32 ~ 256 leads counts available
Fine Pitch wirebond capability
Lead free process ready and available
High conductivity Copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard compliant
 
TQFP/EP-TQFP Packing Offering
10 x 10 mm to 20 x 20 mm body size available
Wide selection of pad size to meet die requirements
Customize leadframe design capability
44 ~ 176 leads counts available
Fine Pitch wirebond capability
Lead free process ready and available
High conductivity Copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard compliant



Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 500/1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
PCT JEDEC 22-A102 121°C/100%RH/15 psi ,96/168 hours
 
Board Level (Contact ATX for further details.)



Package Offering
 
Package Body Size Lead Count Pitch
LQFP 7x7 48 0.5mm
LQFP 7x7 64 0.4mm
LQFP 10x10 44 0.8mm
LQFP 10x10 64 0.5mm
LQFP 10x10 80 0.4mm
LQFP 14x14 100 0.5mm
LQFP 14x14 128 0.4mm
LQFP 14x20 128 0.5mm
LQFP 20x20 144 0.5mm
LQFP 20x20 176 0.4mm
LQFP 24x24 216 0.4mm
LQFP 28x28 208 0.5mm
LQFP 28x28 256 0.4mm
LQFP-EP 20x20 144 0.5mm
LQFP-EP 20x20 176 0.4mm
LQFP-EP 24x24 176 0.5mm
LQFP-EP 28x28 208 0.5mm
LQFP-EP 28x28 256 0.4mm
TQFP 7x7 32 0.5mm
TQFP 7x7 48 0.5mm
TQFP 10x10 64 0.5mm
TQFP 14x14 100 0.5mm
TQFP 14x14 128 0.4mm
TQFP 20x20 144 0.5mm
TQFP 20x20 176 0.4mm
TQFP-EP 7x7 48 0.5mm
TQFP-EP 14x14 128 0.4mm



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