Flip Chip CSP (FCCSP)
| Product Overview |
| FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FCCSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FCCSP features thin and small profile, and lightweight packages. Applications include RFICs and memory ICs. ATX provides packaging service for and Customer-designed size at ball pitches ranging from 0.5 to 1.0mm, and no. of I/Os From 16 to 200. The types of encapsulation are underfill and overmold. |
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| Application |
| Consumer Camcorders, Digital Camera, DVD, WiMAX etc. Computer Voltage regulators, High-speed Memory, Card, PC Peripherals etc. Telecommunication Pagers, Cellular handsets, GPS etc. |
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