SiP Module
| Product Overview |
| The system-in-Package(SiP) module market has grown significantly over the past Several years and it is now one of the fastest growing packaging technologies In the semiconductor industry driven by lower cost, smaller form factor, higher Levels of integration and better performance. SiP Modules are highly adopted by End customers for wireless communication applications including the RF sections Of mobile phone and wireless connectivity. ATX Group is Committed to provide extra value to customers by providing turnkey SiP Module Total solution. |
 |
| Application |
| SIP technology attempts to combine all of the components of a particular function onto a single Device through advanced packaging instead of monolithically through silicon integration. The ability to integrate Different die technologies and to reduce total product cost and time-to-market are the prime drivers for SIP Technology. With these key attributes, SiP Module is widely used in wireless or RF applications such as |
| 1. Power Amplifiers 2. Transceiver 3. Front-end module 4. Antenna switch module 5. Bluetooth 6. WLAN (802.11 a/b/g) 7. GPS/AGPS 8. Mobile-TV (DVB-T/H, DMB, ISBD-T) 9. WiMax (802.16e) |
|