LGA
| Product Overview |
| Land grid array(LGA) uses laminate substrate to form the landing pad and the exposed Pad for performance enhancement. It is essentially a BGA minus the solder balls, LGA’s advantage over other leadless packages are its flexible routing and multi-chip Module capability. LGA is also a thinner (down to 0.5 mm) and lighter CSP. LGA Technology has been developed for lead free solution and spacing reduction on mother Boards. This type of package has chip size solution based on mature laminated Substrate technology and material. |
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| Application | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LGA is suitable for high performance ICs like Single Chip, CPU, Logic and Memory Common applications for this type of package includes: | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Telecommunication products Cellular phone – RF Devices, Wireless LAN Portable products Personal digital assistants, Digital camera, IC recorder, MP3 players
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