| Product Overview |
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| The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the smaller version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The reduced body size means flexible layout is required within a finite PCB area. Another advantage is that shorter leads improve the electrical performance. |
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| Application |
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| ATX’s SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances. |
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| Features |
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| SOP Body sizes 150 up to 300 mils |
| SSOP Body sizes 150 mils |
| SOP lead counts available from 7 to 28 |
| SSOP lead counts available 16 & 24 |
| TSSOP lead counts available 8 to 48 |
| JEDEC standard outlines |
| Existing BOM and process flow |
| Pb-free process ready and available |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 1, 85ºC/85% RH, 168 hrs |
| TCT |
JEDEC 22-A104-B |
-65ºC to 150ºC, 100/300/500/1000 cycles |
| HAST |
JEDEC 22-A118 |
130ºC/85% RH, 33.5 PSI 48/96 hrs |
| HTST |
JEDEC 22-A103-B |
150ºC, 500/1000 hrs |
| PCT |
JEDEC 22-A102 |
121ºC/100%RH/15 psi ,96/168 hours |
| Thermal shock test |
JEDEC JESD22-A106 |
-65ºC~150ºC, 100 / 300 / 500 cycles |
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| Board Level (Contact ATX for further details.) |
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| Package Offering |
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| Package |
Body Size |
Lead Count |
Pitch |
| SO |
150mil |
12, 14, 16, 20 |
1.27mm |
| SO |
160mil |
7, 8 |
1.27mm |
| SO |
150mil |
20, 28 |
1.27mm |
| SSOP |
150mil |
16, 24 |
0.635mm |
| TSSOP |
12mil |
10 |
0.5mm |
| TSSOP |
38mil |
48 |
0.5mm |
| TSSOP |
44mil |
8, 10, 14, 16, 20, 38 |
0.5mm |
| TSSOP |
34mil |
8, 14, 16, 20, 38 |
0.5mm |
| HTSSOP |
38mil |
20 |
0.5mm |
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