Products

Innovation and quality are values that ATXSZ prides itself for delivering leading-edge technologies and solutions to customers, meeting their demanding requirements such as electrical performance, heat dissipation, cost and aggressive cycle time. ATXSZ continues to invest the maximum in research and development through its high caliber engineering teams and advanced manufacturing processes.

The advanced manufacturing process technologies that we provide include flip chip package, test, System in Package (SiP). We also offer standard products such as QFN/DFN,LGA, (H)(T)(S)SOP and (L/T/V)(F)BGA. Our broad product portfolio provides customers the flexibility to select package types that best suit the needs of their chip designs.

ATXSZ has also developed lead-free solutions to eliminate lead in electronic interconnections from both the legislative and competitive sides. We have investigated and tested the performance of various types of lead free solders to generate alternative semiconductor package applications that grant our customers environmentally-friendly chip packages without compromising the reliability.

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